Ntxiv nrog rau sintering thiab tooj liab mesh, txoj hauv kev tseem ceeb rau kev tsim cov cua sov 2D-dissipating capillary structures of vapor chambers (VCs) muaj xws li grooving thiab siv cov hlau nyias zaj duab xis. Los ntawm qhov kev pom zoo, R & D kev siv zog tseem tsom mus ntxiv kom txo cov thermal tiv thaiv thiab txhim kho thermal conductivity kom muaj kev sib haum xeeb nrog cov khoom siv hluav taws xob sib zog, xws li cov khoom ua los ntawm txhuas. Hais txog kev tsim khoom, kev lag luam yog qhov tseem ceeb ntawm kev tsim khoom ntau dua thiab txo tus nqi rau tag nrho cov thermal tswj kev daws teeb meem. Nyob rau hauv cov nqe lus ntawm daim ntawv thov, vapor chambers twb evolved tshaj ib tug -dimensional tshav kub hloov ntawm cov kav dej kub mus rau ob- qhov ntev ntawm tshav kub kis; cov kev daws teeb meem tshiab tam sim no nyob rau hauv kev txhim kho los daws lwm yam kev xav tau kev tswj xyuas thermal. Pragmatically, qhov tseem ceeb tam sim rau vapor chamber manufacturers yog nthuav kev lag luam rau cov khoom uas twb muaj lawm.
Piv txwv li, nyob rau hauv lub foldable smartphone sector, vapor chambers ua los ntawm cov ntaub ntawv xws li tooj liab, stainless hlau, steel - tooj liab composites, aluminium alloys, thiab titanium twb yog loj- muab rau cov thawj coj nyob rau hauv thiab thoob ntiaj teb cov neeg. Tsis tas li ntawd, lub xov tooj smartphone tau tso tawm thaum lub Tsib Hlis 2026 tau nthuav tawm "7K" kua-chamber txias vapor. Cov ntaub ntawv pov thawj los ntawm Lub Xya Hli 2026 qhia tias Apple iPhone 18 Pro series siv lub vapor chamber rau kev tswj hwm thermal, nrog A20 Pro nti tsim los ua kom ncaj nraim nrog lub chamber kom txo qis thermal tiv thaiv thiab txhim kho cov cua sov hauv qab hnyav. Lub caij no, nyob rau hauv lub cheeb tsam ntawm cov kua-cov servers txias rau cov ntaub ntawv chaw, vapor chambers (suav nrog cov qauv VCs thiab 3D VCs) tau nkag mus rau theem ntawm loj- kev lag luam loj thiab kev xa khoom loj.
Saib tom ntej, kev tswj xyuas thermal architectures yuav hloov zuj zus mus nrog cov logic-folding technologies, hloov los ntawm unidirectional heat flow tswj mus rau kev sib koom ua ke ntawm cov nyiaj siv hluav taws xob ntsug. Cov lus qhia tseem ceeb uas muaj peev xwm ua tau zoo xws li embedded micro-channel kua txias uas tau tsav los ntawm kev xa hluav taws xob rov qab thiab kev tswj cov thermal tsis kam ntawm cov khoom sib txuas. Hais txog cov khoom siv tshiab, pob zeb diamond-silicon carbide composites sawv cev rau thaj chaw tseem ceeb. Txoj hauv kev tseem ceeb rau kev nce qib hauv kev tswj hwm thev naus laus zis suav nrog cov khoom siv tshiab, pob- theem micro- channel ua kua txias, thiab qhov system- theem ua kua txias.
